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Bond Plus Nt
Self-Etch Single-Component Adhesive System
- Fast delivery
- Email notifications
- Different payment methods
- Competitive prices
BondPlus NT is 15% filled with 0.4 micron barium glass (also found in the Medicept Flash composite). This unique technology provides the highest level of protection against micro leakage, while sustaining high bond strengths to a variety of surfaces. The filler not only reinforces the hybrid zone, but penetrates the dentin tubules as well, creating a true “structural bond” not found in unfilled or even “nano” filled adhesive systems. With BondPlus NT, adhesion promoters are carried in an ethanol solvent, diminishing both the tedious need for multiple coats and constant re-application commonly found with acetone adhesives. BondPlus NT is indicated for both direct and indirect bonding applications.
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